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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6014 Issued Date : 1996.04.12 Revised Date : 2003.01.07 Page No. : 1/4
HJ882
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HJ882 is designed for using in output stage of 20 W audio amplifier, voltage regulator, DC-DC converter and relay driver.
Absolute Maximum Ratings (Ta=25C)
TO-252
* Maximum Temperatures Storage Temperature ........................................................................................................ -55 ~ +150 C Junction Temperature ................................................................................................................ +150 C * Maximum Power Dissipation Total Power Dissipation (Tc=25C)................................................................................................. 10 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage .................................................................................................. 40 V BVCEO Collector to Emitter Voltage ............................................................................................... 30 V BVEBO Emitter to Base Voltage ....................................................................................................... 5 V IC Collector Current (DC)................................................................................................................... 3 A IC Collector Current (Pulse)............................................................................................................... 7 A IB Base Current (DC).................................................................................................................. 600 mA
Thermal Characteristic
Characteristic Thermal Resistance, junction to case Symbol Rjc Max 12.5 Unit
o
C/W
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. 40 30 5 30 160 Typ. 0.3 1 90 45 Max. 1 1 0.5 2 400 Unit V V V uA uA V V Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=30V, IE=0 VEB=3V, IC=0 IC=2A, IB=0.2A IC=2A, IB=0.2A VCE=2V, IC=20mA VCE=2V, IC=1A VCE=5V, IC=0.1A, f=100MHz VCB=10V, f=1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
MHz pF
Classification Of hFE1
Rank Range Q 100-200 P 160-320 E 250-500
HJ882
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 1000
Spec. No. : HE6014 Issued Date : 1996.04.12 Revised Date : 2003.01.07 Page No. : 2/4
Saturation Voltage & Collector Current
125 C
o
75 C
o
25 C
o
Saturation Voltage (mV)
75 C 100
o
hFE
100
25 C
o
hFE @ VCE=2V 10 1 10 100 1000 10000 10 1
125 C VCE(sat) @ IC=10IB
o
10
100
1000
10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage & Collector Current
1000 1000
Saturation Voltage & Collector Current
Saturation Voltage (mV)
75 C
o
Saturation Voltage (mV)
75 C
o
100 125 C
o
100
25 C
o
125 C
o
25 C
o
VCE(sat) @ IC=40IB 10 1 10 100 1000 10000 10 1 10 100
VCE(sat) @ IC=20IB
1000
10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage & Collector Current
10000 100
Capacitance & Reverse-Biased Voltage
Saturation Voltage (mV)
75 C 1000 25 C
o
o
125 C VBE(sat) @ IC=10IB 100 1 10 100 1000 10000 10 0.1 1 10
o
Capacitance (pF)
Cob
100
Collector Current-IC (mA)
Reverse-Biased Voltage (V)
HJ882
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6014 Issued Date : 1996.04.12 Revised Date : 2003.01.07 Page No. : 3/4
Cutoff Frequency & Collector Current
1000
Safe Operating Area
10000 PT=1ms PT=100ms
Cutoff Frequency (MHz).. .
Collector Current-IC (mA)
1000
PT=1s
100
VCE=5V
100 1 10 100 1000
10 1 10 100
Collector Current (mA)
Forward Voltage-VCE (V)
HJ882
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
A C
Spec. No. : HE6014 Issued Date : 1996.04.12 Revised Date : 2003.01.07 Page No. : 4/4
Marking:
H 882 Date Code J
B
D
Control Code
L
F
G
Style: Pin 1.Base 2.Collector 3.Emitter
3 H E K 2 I 1 J
3-Lead TO-252 Plastic Surface Mount Package HSMC Package Code: J *: Typical
DIM A B C D E F
Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2520 0.2677 0.2125 0.2283
Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.40 6.80 5.40 5.80
DIM G H I J K L
Inches Min. Max. 0.0866 0.1102 *0.0906 0.0354 0.0315 0.2047 0.2165 0.0551 0.0630
Millimeters Min. Max. 2.20 2.80 *2.30 0.90 0.80 5.20 5.50 1.40 1.60
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HJ882
HSMC Product Specification

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